Global advancements in semiconductor chip design have recently taken center stage, reflecting the innovation and strategic collaborations of universities and corporations worldwide. A noteworthy initiative is happening at Universiti Sains Malaysia (USM), where artificial intelligence (AI) is being integrated to transform the high-tech semiconductor chip design process. This effort aims not only to modernize Malaysia's technology sector but also to develop skilled professionals capable of pushing the limits of innovation within the rapidly changing semiconductor industry.
Dr. Assoc. Prof. Dr. Arulnizam Abd Manaf, director of the Collaborative Microelectronic Design Excellence Centre (CEDEC), elaborated on the inherent challenges of chip design, where even minor alterations to circuit architecture necessitate rigorous testing and resource allocation. To alleviate these concerns, USM has created AI software to automate much of the design process. This advancement is significant as it drastically reduces the time and costs traditionally associated with chip design and testing phases.
“AI optimizes chip design by determining the required parameters for features such as oscillator speed, saving us from the hassle of constant redesign,” explained Dr. Arulnizam. Such technology enhances design efficiency and could lead to groundbreaking developments for high-performance chips. Through these advancements, USM aims to engage more collaborations with industry giants like Intel and Infineon and position Malaysia firmly as a global semiconductor hub.
Meanwhile, on the other side of the globe, India is making its own strides with the launch of the ChipIN Centre at C-DAC, which embodies the future of semiconductor design within the country. This center is set up as a consolidated hub offering various advanced design workflows and solutions, thereby connecting national chip design infrastructure with the semiconductor design community. Aimed at supporting the entire chip design process, the ChipIN Centre can handle nodes as tiny as 5 nanometers.
The facility is outfitted with top-tier tools, strong computational infrastructure, and expert services, to cover every aspect of the design process, from conceptualization to fabricator partnerships at the SCL foundry. The centre's initiatives, such as the Chips to Start-up (C2S) Programme and Design Linked Incentive (DLI) Scheme, are geared toward including academic institutions, thereby fostering India's Atmanirbhar Bharat vision of self-sufficiency and innovation.
With the backing of over 20,000 students from more than 250 educational institutions, the ChipIN Centre is aspiring to make Electronic Design Automation (EDA) tools accessible to 85,000 engineering and PhD students over the next five years. This progressive approach supports students, researchers, and entrepreneurs, bridging the gap between education and practical application.
Siemens has also played its part by dynamically extending the reach of its EDA tools under the C2S Programme, now reaching over 250 colleges. Their introduction of advanced hardware-assisted verification solutions marks another step forward, as these new tools can tackle the challenges of designing sophisticated system-on-chip (SoC) and integrated circuits.
According to Ms. Sunita Verma from MeitY, the augmented support from Siemens is anticipated to boost India’s semiconductor ecosystem significantly. Ruchir Dixit, Siemens' Country Manager, emphasized India's potential to become the frontrunner in semiconductor design innovation, highlighting Siemens’ commitment to fostering technological advancements and aiming for India to take center stage globally.
Looking at the broader picture, both USM and India's ChipIN Centre are indicative of how advancements in semiconductor chip designs are paving the way for future innovations. The rise of AI-centric processes at USM is enhancing Malaysia's technological footprint. Meanwhile, India's collaborative approach with significant enterprises like Siemens demonstrates the potential for developing strong domestic capabilities.
Both nations are not simply catching up but are strategically positioning themselves as significant players in the global semiconductor market, riding on the wave of technological development and international partnership. These initiatives reflect the importance of collaborative efforts between educational institutions and the corporate world, inevitably reshaping the semiconductor industry's future on the global stage.