Samsung is making waves in the tech world once again, and this time, it’s not just about a new phone or a flashy gadget. The South Korean giant is charting a bold new course in mobile chip design, aiming to break free from long-standing partnerships and redefine what’s possible for its flagship devices. On December 26, 2025, Samsung officially confirmed the Exynos 2600 chip for the upcoming Galaxy S26, marking a significant leap in both performance and company strategy, according to reporting from Yonhap and TheElec.
For years, Samsung’s Galaxy lineup has relied heavily on external suppliers for its graphics processing units (GPUs), most notably Qualcomm and, more recently, AMD. The Exynos 2600, however, signals a major shift. It’s the world’s first smartphone chip built on a 2nm Gate-All-Around (GAA) process, a cutting-edge technology that promises not only increased efficiency but also massive gains in raw power. By shrinking the node, Samsung claims a 39% boost in CPU performance and a staggering 113% increase in AI processing, as detailed by TheElec. The new chip is designed to run massive generative AI models locally on the phone, all while preserving battery life—a crucial feature in today’s AI-driven world.
But the real story is what’s happening behind the scenes. The Exynos 2600 introduces the Xclipse 960 GPU, which, while still based on AMD’s Radeon architecture, is now physically designed and optimized by Samsung itself. This “Designed by Samsung” label on the silicon level is a first for the company, representing a transition to a 100% in-house GPU design. As SammyFans notes, the Xclipse 960 is built atop AMD’s RDNA4 architecture, specifically a modified MGFX4 version scaled down for mobile use. The previous generation, Exynos 2500, used MGFX3 from AMD’s RDNA3, but this time around, Samsung has doubled the compute performance over the last generation, even as it reduced the maximum clock speed from 999 MHz to 980 MHz. The focus, it seems, is on efficiency rather than just raw speed.
Early benchmarks back up the hype, at least to an extent. Geekbench 6 scores show the Exynos 2600 hitting 22,000 on OpenCL and 22,800 on Vulkan. While the Snapdragon 8 Elite Gen 5 still leads with scores of 23,900 and 27,600 respectively, Samsung’s gap is closing fast—just 10 to 20 percent behind in these synthetic tests, according to SammyFans. For gamers and power users, the Xclipse 960 promises double the compute performance and a 50% increase in ray tracing compared to last year’s chip. And with the introduction of Exynos Neural Supersampling (ENSS)—an AI upscaling tool akin to NVIDIA’s DLSS—users can expect smoother gameplay and higher frame rates without taxing the hardware.
Perhaps the most intriguing part of Samsung’s announcement is its vision for the future. Multiple South Korean media outlets, including Yonhap, report that Samsung is planning to debut a fully proprietary GPU architecture by 2027, likely within the Exynos 2800 for the Galaxy S28. This would mark the end of reliance on AMD’s intellectual property, freeing Samsung from costly licensing fees and allowing for even tighter integration with Galaxy AI features. As one semiconductor industry official explained to TheElec, “Receiving core IP and directly designing the actual internal circuits or physical layout is referred to as ‘utilization.’” It’s a subtle but important distinction—Samsung isn’t just tweaking someone else’s design anymore; it’s building its own from the ground up.
Still, the company isn’t burning bridges just yet. A Samsung representative told SammyFans, “There are many variables in GPU development, and it is difficult to give a definitive answer regarding future in-house development. The LSI Division will continue its cooperation with AMD.” In other words, while the future is in-house, the present remains a hybrid effort.
Thermal management has long been a sore spot for Exynos chips, but Samsung is addressing this head-on with the introduction of Heat Path Block (HPB) technology. This new thermal layer is designed to combat overheating, a reputation that has dogged the Exynos line for years. If HPB delivers as promised, it could finally put those old complaints to rest.
Meanwhile, Samsung is gearing up for a major presence at CES 2026, set to take place in Las Vegas from January 6 to 9. The company has confirmed a brand-new exhibition format called The First Look, establishing a dedicated hall at The Wynn Las Vegas. The exhibition zone, described as museum-style, will showcase the essence of AI and Samsung’s latest technological advances in an industry-leading space. According to SammyFans, the event will feature product exhibitions, tech forums, and interactive sessions with experts from Samsung, partner companies, academia, and the media. The goal? To transform tech presentations into an art form and put the customer experience at the center of it all.
Beyond flagship phones, Samsung’s strategy for its mid-range lineup is also evolving. The Galaxy A37 5G, expected to launch earlier than usual in 2026, will be available in multiple versions tailored for US carriers, Verizon, Canada, and global markets. The device will likely feature the Exynos 1480 chip and a new 50-megapixel camera, running Android 16-based One UI 8.5 out of the box. This mirrors the software experience of the S26 flagships, albeit without Galaxy AI features. According to SammyFans, the Galaxy A36 has already secured a spot among the world’s best-selling phones, and the A37 is poised to follow suit.
Meanwhile, the ultra-slim phone race continues to heat up. Apple’s iPhone Air 2 is rumored to feature a dual-camera setup, matching Samsung’s Galaxy S25 Edge in camera specs, with a potential price drop to $899 to undercut Samsung’s $1,099 S25 Edge. However, sluggish sales have prompted Samsung to put the Galaxy S26 Edge on hold, with a new “More Slim” project under consideration for 2026. Both companies appear to be weighing the long-term viability of ultra-slim designs as they assess market demand.
On the hardware front, February 2026 is shaping up to be a milestone for the global AI market as Samsung and SK Hynix commence mass production of HBM4, the sixth generation of High Bandwidth Memory. According to SeoulEconomicDaily, Samsung will leverage its “turnkey” solution and advanced micro-processing technology to lead production at its Pyeongtaek campus, while SK Hynix will utilize TSMC’s 12nm logic process for its base die. Both companies are major suppliers of HBM4 for NVIDIA’s next-gen AI chip, Rubin, with Samsung boasting a monthly capacity of 170,000 wafers. HBM4 is a critical component for AI servers and datacenters but has also contributed to rising DRAM costs.
For users in the European Union, Apple’s iOS 26.3 update, prompted by the EU’s Digital Markets Act, is opening the door for richer pairing and notification support for non-Apple devices like Samsung’s Galaxy Buds and Watches. This move, while currently limited to the EU, marks a step toward greater interoperability between the two tech giants’ ecosystems.
Samsung’s multi-pronged strategy—pushing the boundaries of chip design, enhancing AI capabilities, and reimagining user experience—signals a company determined not just to keep pace but to set the agenda for the next era of mobile technology. The coming years promise fierce competition, bold innovation, and perhaps, a new chapter in the storied rivalry between the world’s top smartphone makers.
